SERVICES

Manufacturing Technologies

Our engineers and technicians stay current with the latest tech so your project runs smoothly, scales easily, and meets high standards. Whether you’re building a prototype or moving into full production, we’re here to help you deliver a solid, reliable product.

Byte Lab manufacturing
lab

Surface mount Technology (SMT)

Assembly of:

  • Rapid turnaround PCB assembly services
  • Types: Rigid, Flexible, Stretchable
  • Single or double-sided placement
  • Format of PCB supported: 50 mm x 40 mm (min) to 510 mm x 460 mm (max)
  • Component Size: 0402 (01005) to 45 mm x 45 mm
  • Packages Supported: BGA, CSP, QFN, QFP, SOIC, Lead Frame, Pin-In-Paste, Broadband, Flat chips
  • Pitch: Supports fine pitch components down to 0.3 mm.
  • Automated Optical Inspection (AOI)
  • X-Ray
  • Visual Inspection
  • IPC-A-610 compliant
  • IPC J-STD-001 compliant

 

Need a hand?

We can take care of everything — from wiring to final testing.

Through-hole-Technology ( THT )

  • Rapid production in THT
  • Component categories
    • Passive Components: Resistors, capacitors, inductors.
    • Electromechanical Components: Relays, switches, connectors.
    • High-Power Components: Transformers, diodes, power transistors.
    • IC Packages: Dual in-line packages (DIP), transistors, large capacitors.
    • Custom and Specialized Components: Large connectors, mechanical relays, and components that require high mechanical stability.
  • Lead sizes: Ability to handle a variety of lead diameters
  • Soldering methods
    • Manually soldering provided by skilled technicians
    • Selective soldering – Excellent choice for mixed layout of SMT & THT components on same side of PCB
  • Component preparation
    • Manual preparation for special components
    • Automated preparation ( Axial and Radial) machine
  • Precision placement
  • IPC-A-610 compliant
  • IPC J-STD-001 compliant

Box assembly

  • System level assembly
  • Product level assembly
  • Expertise in Cable, Harness, Backplane Assembly and Sub-modules
  • Labeling, Marking, and Heat-Shrink Application
  • Final packaging and transport packaging

Testing and Quality control

  • Development of testing jigs and testing protocols
  • On-board programming – ISP
  • Firmware loading, Version control
  • Support for multiple protocols
  • Programming validation
  • Support for embedded systems and Complex architectures
byte lab

Inventory management

  • Real-time Inventory tracking
  • Just in time (JIT) practices
  • Global logistic network
  • Efficient warehousing solutions
  • Risk mitigation and contingency planning
  • Vendor management and qualification

Mass manufacturing support

  • High volume production capacity
  • Component and process flexibility
  • Customized production solutions
  • End-to-end support
  • Cost-efficiency and Lean Manufacturing
  • Rework services
PROVEN & VERIFIED

Certifications

We take quality and compliance seriously. Our processes are certified to meet globally recognized standards, ensuring reliability, safety, and performance.